The 2nd Croatia - Japan Electromagnetic Compatibility Workshop (CJEMC)
This Electromagnetic Compatibility (EMC) workshop reviews state-of-the-art research results in the field of electromagnetic compatibility of advanced semiconductor integrated electronics and application systems for such as automotive and wireless communications. The prominent researchers from both Croatia and Japan will give in-depth lectures on individual topics and exchange ideas for exploration of international, cross-disciplinary and collaborative research projects.
The 2nd CJEMC workshop is organized by Nation-wide Cooperative Study Group, Tohoku University.
The 1st Croatia - Japan Electromagnetic Compatibility Workshop was held at Zagreb, Croatia in 2018. The information on the 1st CJEMC workshop can be found on the pages of IEEE CAS Croatia Section and the pages of Faculty of Electrical Engineering and Computing, University of Zagreb.
Date
Date: Friday 31th May - Saturday 1st June
Venue
Aoba Memorial Hall, Tohoku University
Access from "Sendai Station"
Subway[Sendai Subway Tozai Line]
From "Sendai" station, take the Subway bound to "Yagiyama Zoological Park". Get off at "Aobayama" station.
- Time / 9 minutes
- Fare / 250 yen
Program
Day 1 (31th May)
| 10:00 - 10:05: | Greetings from Prof. Nagata (Kobe University, Japan) |
| 10:05 - 10:10: | Greetings from Prof. Barić (University of Zagreb, Croatia) |
| 10:10 - 10:15: | Housekeeping announcements |
| 10:15 - 11:05: |
Invited speech 1 (Prof. Adrijan Barić, University of Zagreb, Croatia) Overview of EMC related activities at University of Zagreb Abstract: EMC (Electromagnetic Compatibility) is of utmost importance for reliable operation of circuits and systems. The research group linked to IC&EMC Lab (Integrated Circuits and Electromagnetic Compatibility Laboratory) focuses on various EMC related activities ranging from parametrised modelling of chip packaging, modelling of TEM cells, design and modelling of IC-stripline cells, to modelling of non-perfect ground planes, PCB-IC (printed circuit bord - integrated circuit) co-simulation, design of switching DC/DC converters, isolated power transfer, modelling and estimation of conducted and radiated emissions, including circuit optimization with respect to EMC. The test cases include IC packaging, integrated circuits and systems based of integrated circuits as well as the measurement methods for estimation of EMC. |
| 11:05 - 11:25: | Break |
| 11:25 - 12:10: |
Invited speech 2 (Prof. Makoto Nagata, Kobe University, Japan) Undesired Radio Waves of IoT Devices: Evaluation and Countermeasures Abstract: IoT devices integrates multiple functionality including power management and voltage conversion, data communication and control systems, inherently in a small form factor. The impacts of undesired radio waves on communication performance can be the main problem from EMC standpoints. The talk will start with the mechanisms of undesired radio waves from semiconductor integrated circuit (IC) chips and evaluation techniques. It will then continue to provide system-level simulation technologies of undesired radio wave interference to mobile communications. The remedies against noise emission nearby devices will also be discussed. |
| 12:10 - 13:10: | Lunch |
| 13:10 - 13:40: |
Invited speech 3 (Dr. Koichi Kondo, TOKIN Corporation, Japan) Noise suppression sheet and its application to electromagnetic noise suppression radiated from power electronics equipment Abstract: Noise suppression sheet (NSS), in which soft magnetic metal flakes are embedded in a polymer matrix, is commonly used in portable electronic devices for suppressing radio frequency interferences. On the other hand, high-speed switching devices such as SiC and GaN are increasingly being employed on inverter equipment designs. High frequency electromagnetic noises are generated in such inverters due to harmonics of the switching frequency and so on and radiated as unnecessary radio waves with frequencies of up to several GHz. This leads to a concern that radio communication quality can deteriorate when a mobile terminal is used near the inverter equipment. In this study, we verified the suppression effect of unnecessary radio waves radiated from inverters equipped with SiC or GaN as the switching devices by using NSS. |
| 13:40 - 14:05: |
Oral presentation 1 (Dr. Raul Blecic, University of Zagreb, Croatia) Measurement method based on transverse electromagnetic cell and hybrid coupler for calculation of radiated emission Abstract: Radiated emission of integrated circuits are calculated from the measurements performed by a transverse electromagnetic cell and hybrid coupler. The measurement method and the procedure for the calculation of the far-field data from the measured near-field data are presented. The impedance mismatch between the transverse electromagnetic cell and hybrid coupler is corrected by the transfer functions obtained from the model of the measurement setup. The measurement method is applied to different integrated circuits. The method allows to identify the dominant source of the radiated emission of an integrated circuit under test and to evaluate different methods for the reduction of the radiated emission. |
| 14:05 - 14:30: |
Oral presentation 2 (Mr. Josip Bacmaga, University of Zagreb, Croatia) High-Frequency Modelling of a Setup for Time-Domain Inductor Characterization Abstract: A high-frequency lumped-element model of the setup for time-domain characterization of power inductors is presented. Each block of the circuit is separately modelled and its parameters are optimized to fit the impedance characteristics obtained by measurements or electromagnetic simulations. The extracted models are built of the frequency-independent elements and they are valid up to 100 MHz. Special attention is given to the methodology for modelling of the low-impedance power inductor. The extracted model can be used to correctly reproduce the inductor voltage and current waveforms for various operating conditions, such as different switching frequencies and peak-peak current values. |
| 14:30 - 14:55: |
Oral presentation 3 (Mr. Hrvoje Stimac, University of Zagreb, Croatia) Wideband electro-optical differential voltage measurement system Abstract: Concept of a low-cost isolated voltage measurement system is presented. The electro-optical conversion of the measured signal allows the system to operate in environments with high levels of electromagnetic noise. The signal capture and signal processing stages of the system are divided. The proposed differential voltage measurement system is characterized up to 8 GHz. Characteristics of the system in terms of differential-mode and common-mode signal acquisition are discussed. The limitations of the system in terms of common-mode rejection ratio are explored. Applications of the system for ESD and EMC measurements are proposed. Given the low cost, the system can be implemented both as a standalone probe or as a part of an integrated circuit characterization and test environment. |
| 14:55 - 15:20: |
Oral presentation 4 (Prof. Masahiro Yamaguchi, Tohoku University, Japan) High-Q on-chip C-band inductor with a nanocrystalline MnZn-ferrite film core Abstract:Miniaturized on-chip inductor was developed for the C-band (4-8 GHz) and beyond, to meet the requirements of 5G technology devices. This paper presents the deposition of nanocrystalline manganese-zinc ferrite (MnxZn1-xFe2O4; x=0.5) thin films in a CMOS-compatible way on top of an on-chip inductor structure. The film was deposited by a rapid (<2 min) and low-temperature (<200 ℃) solution-based process under microwave irradiation (2.45 GHz) of 300 W. This is the first report of an on-chip C-band inductor with a manganese-zinc ferrite film core. |
| 15:20 - 15:40: | Break |
| 15:40 - 16:00: |
Oral presentation 5 (Dr. Takahiro Hino, RICOH Electronic Devices Co., Ltd., Japan, and Dr. Hirobumi Watanabe, RICOH Co.,Ltd., Japan) Non-linear DC offset of LDO due to RF noise |
| 16:00 - 16:20: |
Oral presentation 6 (Dr. Takaaki Ibuchi, Osaka University, Japan) EMI noise distribution and propagation in SiC power module Abstract: SiC power modules have been developing for low-loss and high-power density of power converters. However, their superior switching characteristics also lead to EMI issues. This presentation focuses on the practical noise current distribution and propagation in a power module for its switching operation to study low-EMI SiC power module design. |
| 16:20 - 16:40: |
Oral presentation 7 (Dr. Kengo Iokibe, Okayama University, Japan) Noise Source Amplitude Modulation Technique to Estimate Magnitude of Emissions from Individual Integrated Circuits Abstract: A method to separately estimate the magnitude of far-field emission caused by multiple noise sources each has been developed. The method uses the noise source amplitude modulation and correlation analysis (NSM-CA) technique that was firstly developed for determining significant noise sources generating intense emission that affects overall emission dominantly. The technique is now extended to estimate the intensities of emission from individual noise sources. The method including an extended version of the NSM-CA technique is presented. The method was applied to a printed circuit board implementing three line-driver ICs. The intensities of far-field emission induced by the three ICs each were estimated separately and compared with measured intensities in a frequency range up to 1 GHz, indicating excellent agreement even in the higher frequency range. |
| 16:40 - 17:00: |
Oral presentation 8 (Dr. Tohlu Matsushima, Kyushu Institute of Technology, Japan) Transmission-line model of overhead distribution line and modal analysis for detection of fault type Abstract: Detection of a fault point in an overhead distribution system is necessary for accident restoration in power grid. A method of the fault location in the overhead distribution system has been proposed using TDR method. Applying a pulse wave to the overhead distribution line and measuring the reflection wave caused by the fault, we can detect the fault location. In order to analyze the transmission line model of the overhead distribution line, EMC knowledge and multiconductor transmission line theory are useful. In this presentation, the modal reflection coefficients are derived to detect the type of fault, short circuit, discontinuity and grounding in the overhead distribution line. |
| 17:00 - 17:20: |
Oral presentation 9 (Prof. Yu-ichi Hayashi, Nara Institute of Science and Technology, Japan) Effect of Parasitic Elements at Connector Contact Boundary with Contact Failure on Electromagnetic Radiation Abstract: A loosened connector causes an increase in EM radiation when electric devices operate in high-frequency bands. To investigate the mechanisms generating electromagnetic radiation due to a loose contact in a connector, we estimate high-frequency circuit elements at the contact boundary of a loosened connector. Based on this estimation, we show the relationship between high-frequency circuit elements and the electromagnetic radiation from electric devices through experiments. |
| 17:20 - 17:40: |
Oral presentation 10 (Prof. Shinobu Ishigami, and Prof. Ken Kawamata, Tohoku Gakuin University, Japan) Complex antenna factor and antenna gain of folded rhombic antenna for broadband measurements Abstract: A folded rhombic antenna as a broadband antenna for measuring a transient electromagnetic field was designed so that its dimensions were reduced as 1/2 smaller than the original antenna. Antenna gains of their antennas were measured by the 3-antenna method. As a result, a usable frequency range of the antennas is from 400 MHz to 4.8 GHz. |
| 17:40 - 17:50: | Adjourn |
| 18:00 - : | Banquet |
Day 2 (1st June)
| 10:00 - 18:00: |
Open air discussion *Invitation only (Please contact organizers if you are interested.) |
Regisitration
Although the participation in the workshop is free of charge, you are required to register at the link: ONLINE REGISTRATION FORM.
To paticipate in the banquet requred participation fee. More information will be released on the web later.
WiFi Connection
Eduroam will be available on-site. A free guest account will be published at registration desk upon request, if you have not an eduroam account.
Sponsor
| Sponsor: |
Croatia - Japan Electromagnetic Compatibility Workshop, RIEC Nation-wide Cooperative Research Projects, H31/B07, Research Institute of Electrical Communication(RIEC), Tohoku University |
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| Co-Sponsor: |
IEEE Magnetics Society Sendai-Sapporo Joint Section Chapter |
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| Technical Co-Sponsor: | ||
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IEEE EMC Society Sendai Chapter Cyberscience Center, Tohoku University "Sendai Seminar on EMC", Study Group on Electrical Communication, RIEC, Tohoku University "Spinics", Study Group on Electrical Communication, RIEC, Tohoku University |
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Committee
General Co-Chairs: Makoto Nagata (Kobe University), Adrijan Barić, (University of Zagrev)
Organizer: Yu-ichi Hayashi (Nara Institute of Science and Technology)
Treasurer: Masahiro Yamaguchi (Tohoku University)
Program Committee: Makoto Nagata (Chair), Yu-ichi Hayashi, Masahiro Yamaguchi, Tohlu Matsusshima, Takaaki Ibuchi
